美国7050Bliley晶振,BQCSA-12.000MF-BCDGT石英晶振,6G物联网终端晶振,美国Bliley晶振公司,百利晶振,高品质晶振,7050晶振,四脚晶振,贴片晶振,石英晶振,6G物联网晶振,高精度仪器晶振,以太网晶振,无源晶振,SMD封装,标准5X7mm包装尺寸,高温下高稳定性
美国7050Bliley晶振,BQCSA-12.000MF-BCDGT石英晶振,6G物联网终端晶振
| 频率范围 | 5.5 – 60.0 | 40.0 – 125.0 | MHz | |
| 频率容差 | @ + 25℃ | ±50 Max (see options) | ppm | |
| 频率偏差度 | ±100 Max (see options) | ppm | ||
| 老化 | Max 1st Year | ±5.0 | ppm | |
| 等效串联电阻 | 5.5 – 8.0 MHz | 100 | ? | |
| 8.0 – 11.99 MHz | 70 | ? | ||
| 12.0 – 20.0 MHz | 50 | ? | ||
| 20.0 – 50.0 MHz | 40 | ? | ||
| 40.0 – 125.0 MHz | 80 | ? | ||
| 绝缘电阻 | Min @ 100Vdc ±15Vdc | 500 | M? | |
| 驱动电平 | Typical | 100 | μW | |
| C0 (分流电容) | Max (typical) | 5.0 | pF | |
| CL (负载电容) | Per Option (typical) | 6-20 (see options) | pF | |
| DLD | 50nW to 100µW | ±10 Max | ppm | |
| RLD | 50nW to 100µW | 20% Max | ? | |
| 工作温度范围 | -20 to +70 / -40 to +85 | OC | ||
| 储存温度范围 | -55 to +125 | OC | ||
美国7050Bliley晶振,BQCSA-12.000MF-BCDGT石英晶振,6G物联网终端晶振








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