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1XSR033333AB,DSO751SRAB工业级晶振,33.3333MHz晶振
更多 +Mfr.# 制造商产品编号
1XSR016667AB
Series 系列型号
DSO751SRAB
Product Type 产品类型
xo
Manufacturer 品牌
KDS贴片晶振
Frequency 频率
33.3333M
Operating Temperature Range工作温度范围
-40~+85℃
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1XSR012582AB,DSO751SRAB车载时钟晶振,12.5829MHz晶振
更多 +Mfr.# 制造商产品编号
1XSR016667AB
Series 系列型号
DSO751SRAB
Product Type 产品类型
xo
Manufacturer 品牌
Frequency 频率
12.5829M
Operating Temperature Range工作温度范围
-40~+85℃
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1XSR016667AB,DSO751SRAB振荡器,16.667MHz晶振
更多 +Mfr.# 制造商产品编号
1XSR016667AB
Series 系列型号
DSO751SRAB
Product Type 产品类型
xo
Manufacturer 品牌
Frequency 频率
16.667M
Operating Temperature Range工作温度范围
-40~+85℃
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DSC1018DI2-070.0000T,2520mm,70MHz,Microchip工业应用晶振
DSC1018DI2-070.0000T,2520mm,70MHz,Microchip工业应用晶振，美国进口晶振，Microchip晶振，型号：DSC1018，编码为：DSC1018DI2-070.0000T，频率为：70.000MHz，电压：1.8V，工作温度范围：-40℃至+85℃，频率稳定性：±25ppm，小体积晶振尺寸：2.5x2.0mm，四脚贴片晶振，石英晶振，石英晶体振荡器。DSC1018是一个1.8V固定频率MEMS基于纯硅™振荡器。它可以被工厂编程到从1到150MHz的任何频率。DSC1018包含了一个全硅谐振器，它非常坚固，几乎不受应力相关裂缝的影响，这是晶体振荡器常见的。在不牺牲当今系统所需的性能和稳定性的情况下，无晶体设计允许更高水平的可靠性，DSC1018非常适合坚固、工业和便携式应用，其中应力、冲击和振动可能会损害基于石英晶体的系统。应用程序：移动通讯应用，消费电子产品，便携式电子设备，无人机晶振，车载导航晶振，工业应用等。更多 +
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EUROQUARTZ晶振,贴片晶振,EQ160晶振,4819消费电子晶振
更多 +小体积SMD时钟晶体谐振器,是贴片音叉晶体,千赫频率元件,应用于时钟模块,智能手机,全球定位系统,因产品本身体积小,SMD编带型,可应用于高性能自动贴片焊接,被广泛应用到各种小巧的便携式消费电子数码时间产品,环保性能符合ROHS/无铅标准.
- [常见问题]River大河晶振AT切割与GT切割的具体差异2026年06月17日 09:12
- River大河晶振AT切割与GT切割的具体差异
在石英晶振制造行业中,晶片切割工艺是决定晶振核心性能的底层核心技术,也是区分晶振等级,适配场景,品质优劣的关键标准.很多电子工程师在设备调试,产品量产过程中遇到的时序漂移,信号不稳,高低温失效,计时偏差,设备频繁重启等疑难故障,溯源排查后绝大多数问题都源于晶振切割工艺选型不匹配.同一产地,同一材质的天然石英原石,经过不同角度,不同方式,不同工艺标准的切割打磨后,成型晶片的物理振动特性,应力结构,温变系数,老化速度会产生天壤之别,最终直接决定成品晶振的频率精度,温度稳定性,抗震抗扰性,使用寿命,深刻影响各类电子设备的时序运行与整机品质.在River大河晶振全系产品体系中,AT切割与GT切割是两大经典,应用最广泛的核心切割工艺,覆盖了从民用消费电子,智能家居,无线通信设备,到工业自动化控制,车载汽车电子,精密仪器仪表,物联网测控终端等全品类电子设备场景,是目前电子制造业最常用的两种晶体切割方案.消费电子晶振的主流工艺。"},"attribs":{"0":"*0*1+9*0*1*2+b*0*1+4m"},"rows":{},"cols":{}}},"type":"text"}},"EWQgfv5AYddWkdc9bxGcy4Xrnfc":{"id":"EWQgfv5AYddWkdc9bxGcy4Xrnfc","snapshot":{"ai_extra":{"rewrite_command":1},"align":"left","author":"7592593332774128587","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"X6K1dFqH1oWPJbx0lQqcRyoOnvc","revisions":[],"text":{"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7592593332774128587"],"2":["bold","true"]},"nextNum":3,"attribToNum":{"ai-extra,{\"is_ai_gen\":true,\"rewrite_command\":1}":0,"author,7592593332774128587":1,"bold,true":2}},"initialAttributedTexts":{"text":{"0":"2、River GT切割晶体（面剪切振动）"},"attribs":{"0":"*0*1*2+l"},"rows":{},"cols":{}}},"type":"text"}},"FTE5fPbBddYRaRcOJR9cz9OunEe":{"id":"FTE5fPbBddYRaRcOJR9cz9OunEe","snapshot":{"ai_extra":{"rewrite_command":1},"align":"left","author":"7592593332774128587","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"X6K1dFqH1oWPJbx0lQqcRyoOnvc","revisions":[],"text":{"initialAttributedTexts":{"text":{"0":"GT切割属于经典的低频高精度切割工艺，采用专属特殊角度切割，依托石英晶体表面剪切振动模式运行。与AT切割厚度振动不同，GT切割晶体的振动频率由晶片的平面尺寸、长宽比例决定，不依赖晶片厚度。该工艺针对性优化低频工况特性，最大优势是低温漂、高稳定，是传统低频精密时序晶振的核心切割方案，River大河晶振高端低频精密型号多采用此工艺。"},"attribs":{"0":"*0*1+4l"}},"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7592593332774128587"]},"nextNum":2}},"type":"text"}},"X6K1dFqH1oWPJbx0lQqcRyoOnvc":{"id":"X6K1dFqH1oWPJbx0lQqcRyoOnvc","snapshot":{"type":"page","parent_id":"","comments":[],"revisions":[],"locked":false,"hidden":false,"author":"7592593332774128587","children":["U4YxfL284dyRm4ctKc7cOXACnNg","QUcEfpVuvdU8X9cuunbcN6windf","TdnlfDPeKdRNuxcGUykcTyxsnwc","AqCCfVyjyd95oRc9cUccY8uqn0g","AxgRfDHH0dtCFDce8iEcZqRUn1d","ZKslfSkF9dONzmcLrrbczXWHnQf","EWQgfv5AYddWkdc9bxGcy4Xrnfc","FTE5fPbBddYRaRcOJR9cz9OunEe","Zq9afyVjodiGQJcCtApc6FXnnkh","LdzofXeBTdvVaMc1X8Xcxu8pn1b","Dq7DfnB1edxyOwcJMppc0wJCneh","AlLnfEqg1dDvu3cC6HMcUfclntB","OXqGf4JuhdDCkZcebcUcGIk1nyc","PP6Bf504qdDgi2cGMY3cHZNKnFh","QbSjf6qbjds51VcKPDbcSn0cnqQ","WZ4pf8ZaSdmHE9cAnowc89ZLnXg","YRsAfPkk7dF6COcl6uhcqEd9nDe","Stp9feyCpdAUXzcjpjSc5lz5n4e","Jwxpfn6QndROsVcXkR3cz6QXnOe","ElkgfwzB4dnqwWc0c3Jcyg6rnCe","Pi8hfW9CcdIJrTc8au4cUKyYn9b","OO9WfmrhJdC3woclPPBctINunzb","Xi4IfHy12d71JFcXzczcVBdwnUb","ZMQ8f8r6gdF54pcO4XHc6W2Nnib","XsYef6WbddG3jocYPY7cYe9bn2b","G2eAfYIQzdhHsmciECacYPU6nxe","UY2KfxtJAd7CGDcdS9zcW1jFnIe","IHjpfQ6ELdvjpzcKtE8cnIcjnuc","W9rjfMsQXdYDh5cdno3cv1yInIb","Q8srfNZdddN42rcH69TcH8Bknxc","PJ5Efke5qdwwQ4cxLkZcNUWHn5d","DzoUftgaadIBGucBs2Mcanj2njh","AguVfcpfddO0DocEz4VcBmuOnkN","IBUVfcdC0draY4cY8U8cvlIlnJb","HbbAfhgsjdJgEYc1aJtcHLBtn2c","FjWkfVSTzdacWGcPK0xcCFRFnHd","Myg5fXpuPdLd1bc4XqqcHkfRnbh","E6pAfYi6KduYJ0cLo2gc25kmnWh","D9v5f59ndd8nsCczflNc3Cs1nOd"],"text":{"apool":{"nextNum":2,"numToAttrib":{"0":["author","7592593332774128587"],"1":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"]}},"initialAttributedTexts":{"attribs":{"0":"*0*1+11"},"text":{"0":"硬核科普：River大河晶振AT切割晶体与GT切割晶体的核心区别与选型指南"}}},"align":"","doc_info":{"editors":["7592593332774128587"],"options":["editors","edit_time"],"deleted_editors":null,"option_modified":null},"revision_container_id":"doxcnInribDzteQ9UfelEkkkSOb","status":{"streaming":{"enabled":false,"expired_at":"1781658682","is_create_command":true,"operator_id":"7592593332774128587","source":1}}}}},"payloadMap":{"AqCCfVyjyd95oRc9cUccY8uqn0g":{"level":1},"AxgRfDHH0dtCFDce8iEcZqRUn1d":{"level":1},"ZKslfSkF9dONzmcLrrbczXWHnQf":{"level":1},"EWQgfv5AYddWkdc9bxGcy4Xrnfc":{"level":1},"FTE5fPbBddYRaRcOJR9cz9OunEe":{"level":1}},"extra":{"channel":"saas","pasteRandomId":"58773d8e-0baf-4e3c-979a-13a5ed9e970c","mention_page_title":{},"external_mention_url":{},"isEqualBlockSelection":true},"isKeepQuoteContainer":false,"selection":[{"id":5,"type":"text","selection":{"start":0,"end":63},"recordId":"AqCCfVyjyd95oRc9cUccY8uqn0g"},{"id":6,"type":"text","selection":{"start":0,"end":22},"recordId":"AxgRfDHH0dtCFDce8iEcZqRUn1d"},{"id":7,"type":"text","selection":{"start":0,"end":186},"recordId":"ZKslfSkF9dONzmcLrrbczXWHnQf"},{"id":8,"type":"text","selection":{"start":0,"end":21},"recordId":"EWQgfv5AYddWkdc9bxGcy4Xrnfc"},{"id":9,"type":"text","selection":{"start":0,"end":165},"recordId":"FTE5fPbBddYRaRcOJR9cz9OunEe"}],"pasteFlag":"ca236786-273a-462e-a221-8779b358918a"}'> - 阅读（100）
- [根栏目]泰艺TF系列TCXO产品赋能设备小型化升级2026年04月03日 11:12
泰艺TF系列TCXO产品赋能设备小型化升级
作为全球领先的频率控制元件制造商,台湾泰艺电子(TAITIEN)凭借近50年的技术深耕与行业实战积累,始终以市场需求为导向,深耕TCXO领域,持续突破技术瓶颈.近期,泰艺电子重磅推出TF系列超紧凑型,高精度,低G敏感度TCXO产品,该系列产品以"超小尺寸,超高精度,超低G敏感度"为核心亮点,兼顾低功耗,高稳定性等优势,彻底解决了传统TCXO的应用痛点,重新定义了小型化设备的时钟基准标准,为各行业设备小型化,高精度升级提供了革命性的解决方案,赋能终端产品实现性能与体积的双重突破.- 阅读（84）
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