
-
西铁城晶振,贴片晶振,CM309S晶体
更多 +工作温度:-40℃~+85℃
保存温度:-55℃~+125℃
负载电容:16pF
晶体在极端严酷的环境条件下也能发挥稳定的起振特性,晶振本身具有耐热,耐振,耐冲击等优良的耐环境特性,满足无铅焊接的高温回流温度曲线要求,符合AEC-Q200标准.

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西铁城晶振,无源晶振,CM309E晶振
更多 +工作温度:-40℃~+85℃
保存温度:-55℃~+125℃
负载电容:18pF
外观采用陶瓷封装,具有充分的密封性能,晶振本身能确保其高可靠性,采用编带包装,可对应产品应用到自动贴片机告诉安装,满足无铅焊接的高温回流温度曲线要求.

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西铁城晶振,进口晶振,CM309B晶振
更多 +工作温度:-40℃~+85℃
保存温度:-55℃~+125℃
负载电容:16pF
在极端严酷的环境条件下也能发挥稳定的起振特性,产品本身具有耐热,耐振,耐撞击等优良的耐环境特性,满足无铅焊接的回流温度曲线要求.

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西铁城晶振,石英晶体,CM309A晶振
更多 +工作温度:-40℃~+85℃
保存温度:-55℃~+125℃
负载电容:16pF
小型表面贴片晶振型,是标准的石英晶体谐振器,适用于宽温范围的电子数码产品,家电电器及MP3,MP4,播放器,单片机等领域.可对应3.500MHz以上的频率.

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西铁城晶振,贴片晶体,CM212晶振
工作温度:-40℃~+85℃ 保存温度:-55℃~+125℃ 负载电容:12.5pF 32.768K时钟晶体具有小型,薄型,轻型的贴片晶振表面音叉型晶体谐振器,产品具有优良的耐热性,耐环境特性,可发挥晶振优良的电气特性,符合RoHS规定.更多 +

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西铁城晶振,SMD晶振,CM250S晶振
更多 +工作温度:-40℃~+85℃
保存温度:-55℃~+125℃
负载电容:12.5pF
贴片表晶32.768K系列具有超小型,薄型,质地轻的表面贴片音叉型石英晶体谐振器,晶振产品本身具备优良的耐热性,耐环境特性.

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西铁城晶振,石英晶体,CM200S晶振
工作温度:-40℃~+85℃ 保存温度:-55℃~+125℃ 负载电容:12.5pF 晶体具有优良的耐环境特性,如耐热性,耐冲击性,在办公自动化,家电相关电器领域及Bluetooth,Wireless LAN等短距离无线通信领域可发挥优良的电气特性,满足无铅焊接的回流温度曲线要求.更多 +

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西铁城晶振,进口晶振,CM250C晶振
工作温度:-40℃~+85℃ 保存温度:-55℃~+125℃ 负载电容:12.5pF 贴片晶振本身体积小,超薄型石英晶体谐振器,特别适用于有目前高速发展的高端电子数码产品,因为晶振本身小型化需求的市场领域.更多 +

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西铁城晶振,无源晶振,CM200C晶振
工作温度:-40℃~+85℃ 保存温度:-55℃~+125℃ 负载电容:12.5pF 适用于宽温范围的电子数码产品,家电电器及MP3,MP4,播放器,单片机等领域.可对应8.000MHz以上的频率,在电子数码产品,以及家电相关电器领域里面发挥优良的电气特性,满足无铅焊接的回流温度曲线要求.更多 +

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西铁城晶振,贴片晶振,CM130晶振
工作温度:-40℃~+85℃ 保存温度:-55℃~+125℃ 负载电容:12.5pF 32.768K时钟晶体具有小型,薄型,轻型的贴片晶振表面音叉型晶体谐振器,产品具有优良的耐热性,耐环境特性,可发挥晶振优良的电气特性,符合RoHS规定.更多 +

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西铁城晶振,32.768K晶振,CFV-206晶振
工作温度:-20℃~+70℃更多 +
保存温度:-40℃~+85℃
负载电容:12.5pF
插件表晶32.768K系列具有超小型,质地轻的表面贴片音叉型石英晶体谐振器,金属外壳的石英晶振使得产品在封装时能发挥比陶瓷晶振外壳更好的耐冲击性能.

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KDS晶振,32.768K晶振,DST1210A晶振
32.768K系列产品本身具有体积小,厚度薄,重量轻等特点,此音叉型石英晶体谐振器,晶振产品本身具备优良的耐热性,耐环境特性,在办公自动化,家电领域,移动通信领域可发挥优良的电气特性,符合无铅标准,满足无铅焊接的回流温度曲线要求.更多 +

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KDS晶振,32.768K晶体,DST210AC晶振
32.768K系列产品本身具有体积小,厚度薄,重量轻等特点,此音叉型石英晶体谐振器,晶振产品本身具备优良的耐热性,耐环境特性,在办公自动化,家电领域,移动通信领域可发挥优良的电气特性,符合无铅标准,满足无铅焊接的回流温度曲线要求.更多 +

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西铁城晶振,圆柱晶振,CFS-206晶振
工作温度:-20℃~+70℃更多 +
保存温度:-40℃~+85℃
负载电容:12.5pF
32.768K时钟晶体具有小型,轻型的圆柱晶振表面音叉型晶体谐振器,产品具有优良的耐热性,耐环境特性,可发挥晶振优良的电气特性,符合RoHS规定.

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精工晶振,高端晶体,SC-32P晶振,Q-SC32P03220E6C5ADF晶振
二脚SMD金属面贴片晶振,表面金属封装,其实是属于压电石英晶振,是高可靠的环保性能,严格的频率分选,编带盘装,可应用于高速自动贴片机焊接,产品本身设计合理,成本和性能良好,产品被广泛应用于平板电脑,MP5,数码相机,USB接口最佳选择,包含RoHS指令豁免的密封玻璃中的铅.更多 +

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SEIKO晶振,石英晶体谐振器,SC-32A晶振
工作温度:-55°~125° 储存温度:-55°~125° 负载电容:12.5PF 贴片晶振本身体积小,超薄型石英晶体谐振器,特别适用于有目前高速发展的高端电子数码产品,因为晶振本身小型化需求的市场领域,广泛用于笔记本电脑,无线电话,卫星导航HDD, SSD, USB, Blu-ray等用途,符合无铅焊接的高温回流焊曲线特性更多 +

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精工晶振,贴片石英晶振,SC-12S晶振
1210mm体积的晶振,可以说是目前小型数码产品的福音,目前超小型的智能手机里面所应用的就是小型的石英晶振,该产品最适用于无线通讯系统,无线局域网更多 +

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SEIKO晶振,圆柱晶振,VT-120-F晶振
千赫频率元件,应用于时钟模块,智能手机,全球定位系统,因产品本身体积小,被广泛应用到各种小巧的便携式消费电子数码时间产品,儿童玩具等环保性能符合ROHS/无铅标准.更多 +
- [常见问题]River大河晶振AT切割与GT切割的具体差异2026年06月17日 09:12
- River大河晶振AT切割与GT切割的具体差异
在石英晶振制造行业中,晶片切割工艺是决定晶振核心性能的底层核心技术,也是区分晶振等级,适配场景,品质优劣的关键标准.很多电子工程师在设备调试,产品量产过程中遇到的时序漂移,信号不稳,高低温失效,计时偏差,设备频繁重启等疑难故障,溯源排查后绝大多数问题都源于晶振切割工艺选型不匹配.同一产地,同一材质的天然石英原石,经过不同角度,不同方式,不同工艺标准的切割打磨后,成型晶片的物理振动特性,应力结构,温变系数,老化速度会产生天壤之别,最终直接决定成品晶振的频率精度,温度稳定性,抗震抗扰性,使用寿命,深刻影响各类电子设备的时序运行与整机品质.在River大河晶振全系产品体系中,AT切割与GT切割是两大经典,应用最广泛的核心切割工艺,覆盖了从民用消费电子,智能家居,无线通信设备,到工业自动化控制,车载汽车电子,精密仪器仪表,物联网测控终端等全品类电子设备场景,是目前电子制造业最常用的两种晶体切割方案.128587","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"X6K1dFqH1oWPJbx0lQqcRyoOnvc","revisions":[],"text":{"initialAttributedTexts":{"text":{"0":"石英晶体的核心工作原理是压电效应,而切割角度直接决定晶片的振动模式、应力分布与物理特性,这也是AT切割与GT切割最根本的区别。"},"attribs":{"0":"*0*1+1r"}},"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7592593332774128587"]},"nextNum":2}},"type":"text"}},"AxgRfDHH0dtCFDce8iEcZqRUn1d":{"id":"AxgRfDHH0dtCFDce8iEcZqRUn1d","snapshot":{"ai_extra":{"rewrite_command":1},"align":"left","author":"7592593332774128587","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"X6K1dFqH1oWPJbx0lQqcRyoOnvc","revisions":[],"text":{"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7592593332774128587"],"2":["bold","true"]},"nextNum":3,"attribToNum":{"ai-extra,{\"is_ai_gen\":true,\"rewrite_command\":1}":0,"author,7592593332774128587":1,"bold,true":2}},"initialAttributedTexts":{"text":{"0":"1、River AT切割晶体(厚度剪切振动)"},"attribs":{"0":"*0*1*2+m"},"rows":{},"cols":{}}},"type":"text"}},"ZKslfSkF9dONzmcLrrbczXWHnQf":{"id":"ZKslfSkF9dONzmcLrrbczXWHnQf","snapshot":{"ai_extra":{"rewrite_command":1},"align":"left","author":"7592593332774128587","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"X6K1dFqH1oWPJbx0lQqcRyoOnvc","revisions":[],"text":{"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7592593332774128587"],"2":["bold","true"]},"nextNum":3,"attribToNum":{"ai-extra,{\"is_ai_gen\":true,\"rewrite_command\":1}":0,"author,7592593332774128587":1,"bold,true":2}},"initialAttributedTexts":{"text":{"0":"AT切割是目前行业应用最普及、量产最成熟的石英晶体切割工艺。River大河晶振AT切割工艺采用精准的35°15′切割角度,依托石英晶体厚度剪切振动模式工作。简单来说,晶片通电后依靠本体厚度方向产生高频剪切振动,振动频率主要由晶片厚度决定,厚度越薄,输出频率越高。该切割工艺容错率低、加工精度高、量产稳定性极强,是River高频晶振、通用型工业晶振、消费电子晶振的主流工艺。"},"attribs":{"0":"*0*1+9*0*1*2+b*0*1+4m"},"rows":{},"cols":{}}},"type":"text"}},"EWQgfv5AYddWkdc9bxGcy4Xrnfc":{"id":"EWQgfv5AYddWkdc9bxGcy4Xrnfc","snapshot":{"ai_extra":{"rewrite_command":1},"align":"left","author":"7592593332774128587","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"X6K1dFqH1oWPJbx0lQqcRyoOnvc","revisions":[],"text":{"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7592593332774128587"],"2":["bold","true"]},"nextNum":3,"attribToNum":{"ai-extra,{\"is_ai_gen\":true,\"rewrite_command\":1}":0,"author,7592593332774128587":1,"bold,true":2}},"initialAttributedTexts":{"text":{"0":"2、River GT切割晶体(面剪切振动)"},"attribs":{"0":"*0*1*2+l"},"rows":{},"cols":{}}},"type":"text"}},"FTE5fPbBddYRaRcOJR9cz9OunEe":{"id":"FTE5fPbBddYRaRcOJR9cz9OunEe","snapshot":{"ai_extra":{"rewrite_command":1},"align":"left","author":"7592593332774128587","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"X6K1dFqH1oWPJbx0lQqcRyoOnvc","revisions":[],"text":{"initialAttributedTexts":{"text":{"0":"GT切割属于经典的低频高精度切割工艺,采用专属特殊角度切割,依托石英晶体表面剪切振动模式运行。与AT切割厚度振动不同,GT切割晶体的振动频率由晶片的平面尺寸、长宽比例决定,不依赖晶片厚度。该工艺针对性优化低频工况特性,最大优势是低温漂、高稳定,是传统低频精密时序晶振的核心切割方案,River大河晶振高端低频精密型号多采用此工艺。"},"attribs":{"0":"*0*1+4l"}},"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7592593332774128587"]},"nextNum":2}},"type":"text"}},"X6K1dFqH1oWPJbx0lQqcRyoOnvc":{"id":"X6K1dFqH1oWPJbx0lQqcRyoOnvc","snapshot":{"type":"page","parent_id":"","comments":[],"revisions":[],"locked":false,"hidden":false,"author":"7592593332774128587","children":["U4YxfL284dyRm4ctKc7cOXACnNg","QUcEfpVuvdU8X9cuunbcN6windf","TdnlfDPeKdRNuxcGUykcTyxsnwc","AqCCfVyjyd95oRc9cUccY8uqn0g","AxgRfDHH0dtCFDce8iEcZqRUn1d","ZKslfSkF9dONzmcLrrbczXWHnQf","EWQgfv5AYddWkdc9bxGcy4Xrnfc","FTE5fPbBddYRaRcOJR9cz9OunEe","Zq9afyVjodiGQJcCtApc6FXnnkh","LdzofXeBTdvVaMc1X8Xcxu8pn1b","Dq7DfnB1edxyOwcJMppc0wJCneh","AlLnfEqg1dDvu3cC6HMcUfclntB","OXqGf4JuhdDCkZcebcUcGIk1nyc","PP6Bf504qdDgi2cGMY3cHZNKnFh","QbSjf6qbjds51VcKPDbcSn0cnqQ","WZ4pf8ZaSdmHE9cAnowc89ZLnXg","YRsAfPkk7dF6COcl6uhcqEd9nDe","Stp9feyCpdAUXzcjpjSc5lz5n4e","Jwxpfn6QndROsVcXkR3cz6QXnOe","ElkgfwzB4dnqwWc0c3Jcyg6rnCe","Pi8hfW9CcdIJrTc8au4cUKyYn9b","OO9WfmrhJdC3woclPPBctINunzb","Xi4IfHy12d71JFcXzczcVBdwnUb","ZMQ8f8r6gdF54pcO4XHc6W2Nnib","XsYef6WbddG3jocYPY7cYe9bn2b","G2eAfYIQzdhHsmciECacYPU6nxe","UY2KfxtJAd7CGDcdS9zcW1jFnIe","IHjpfQ6ELdvjpzcKtE8cnIcjnuc","W9rjfMsQXdYDh5cdno3cv1yInIb","Q8srfNZdddN42rcH69TcH8Bknxc","PJ5Efke5qdwwQ4cxLkZcNUWHn5d","DzoUftgaadIBGucBs2Mcanj2njh","AguVfcpfddO0DocEz4VcBmuOnkN","IBUVfcdC0draY4cY8U8cvlIlnJb","HbbAfhgsjdJgEYc1aJtcHLBtn2c","FjWkfVSTzdacWGcPK0xcCFRFnHd","Myg5fXpuPdLd1bc4XqqcHkfRnbh","E6pAfYi6KduYJ0cLo2gc25kmnWh","D9v5f59ndd8nsCczflNc3Cs1nOd"],"text":{"apool":{"nextNum":2,"numToAttrib":{"0":["author","7592593332774128587"],"1":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"]}},"initialAttributedTexts":{"attribs":{"0":"*0*1+11"},"text":{"0":"硬核科普:River大河晶振AT切割晶体与GT切割晶体的核心区别与选型指南"}}},"align":"","doc_info":{"editors":["7592593332774128587"],"options":["editors","edit_time"],"deleted_editors":null,"option_modified":null},"revision_container_id":"doxcnInribDzteQ9UfelEkkkSOb","status":{"streaming":{"enabled":false,"expired_at":"1781658682","is_create_command":true,"operator_id":"7592593332774128587","source":1}}}}},"payloadMap":{"AqCCfVyjyd95oRc9cUccY8uqn0g":{"level":1},"AxgRfDHH0dtCFDce8iEcZqRUn1d":{"level":1},"ZKslfSkF9dONzmcLrrbczXWHnQf":{"level":1},"EWQgfv5AYddWkdc9bxGcy4Xrnfc":{"level":1},"FTE5fPbBddYRaRcOJR9cz9OunEe":{"level":1}},"extra":{"channel":"saas","pasteRandomId":"58773d8e-0baf-4e3c-979a-13a5ed9e970c","mention_page_title":{},"external_mention_url":{},"isEqualBlockSelection":true},"isKeepQuoteContainer":false,"selection":[{"id":5,"type":"text","selection":{"start":0,"end":63},"recordId":"AqCCfVyjyd95oRc9cUccY8uqn0g"},{"id":6,"type":"text","selection":{"start":0,"end":22},"recordId":"AxgRfDHH0dtCFDce8iEcZqRUn1d"},{"id":7,"type":"text","selection":{"start":0,"end":186},"recordId":"ZKslfSkF9dONzmcLrrbczXWHnQf"},{"id":8,"type":"text","selection":{"start":0,"end":21},"recordId":"EWQgfv5AYddWkdc9bxGcy4Xrnfc"},{"id":9,"type":"text","selection":{"start":0,"end":165},"recordId":"FTE5fPbBddYRaRcOJR9cz9OunEe"}],"pasteFlag":"ca236786-273a-462e-a221-8779b358918a"}'> - 阅读(93)
- [常见问题]TX7-705CM-SQ-HPG高性能晶振的机械耐受优势2026年06月15日 15:15
TX7-705CM-SQ-HPG高性能晶振的机械耐受优势
作为国际知名高精度频率器件品牌,QuartzCom深耕高端晶振研发与制造多年,聚焦恶劣工况下的设备可靠性痛点,针对性推出TX7-705CM-SQ-HPG高可靠振荡器产品.该型号凭借独家加固结构设计,精密晶片封装工艺,极致的力学耐受性能,实现了行业顶尖的抗冲击,抗震动能力,完美适配各类高震动,高冲击,复杂动态工况,是工业,车载,户外,军工高可靠设备的优选时钟器件.128587"],"1":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"2":["bold","true"]},"nextNum":3}},"type":"text","referenceRecordMap":{},"extra":{"channel":"saas","isEqualBlockSelection":false,"pasteRandomId":"37e5f532-81f4-40da-ab75-6e346b074c88","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":3,"type":"text","selection":{"start":0,"end":182},"recordId":"Oup4fIgj1dooaRcYND9ce0oLnng"}],"payloadMap":{},"isCut":false}'>- 阅读(65)
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